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US 2025/0084908 A1Published application
Designs and manufacturing methods for lightweight hyperdamping materials providing large attenuation of broadband-frequency structure-borne sound
AssigneeOSIF, Energy Advancement and Innovation Center
InventorRyan L. Harne
Life of this patent
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Abstract
A hyperdamping inclusion under constraint with large, broadband frequency damping properties is disclosed. The inclusion includes materials under near-buckling constraint such that fundamental eigenfrequency vanishes at near-buckling.
Claims1
A wave attenuation device, comprising:
- an elastic metamaterial;
- at least two voids in the elastic metamaterial;
- the elastic metamaterial under a stress constraint such that the elastic material is near a buckling condition.
Dependencies are inferred from the claim text.