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AssigneeKokusai Electric Corporation
InventorsKazuyuki OKUDA, Tomoki IMAMURA, Takaaki NODA
Estimating the term…
A technique including: a process container accommodating a substrate; a first nozzle including a side surface with a first discharge opening directed toward a substrate arrangement region where the substrate is arranged in the process container; a second nozzle including a side surface with a second discharge opening opened to be directed toward at least one of a portion of the side surface of the first nozzle in a range different from a range where the first discharge opening is formed and a space between the portion and an inner wall surface of the process container; a source gas supply system that supplies a source gas into the process container via the first nozzle; and an inert gas supply system that supplies an inert gas into the process container via the second nozzle.
A substrate processing apparatus comprising:
A method of manufacturing a semiconductor device, comprising:
A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process comprising:
Dependencies are inferred from the claim text.