Slurry and polishing method
AssigneeResonac Corporation
InventorsSatoyuki NOMURA, Tomohiro IWANO, Takaaki MATSUMOTO, Tomoyasu HASEGAWA, Tomomi KUKITA
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AssigneeResonac Corporation
InventorsSatoyuki NOMURA, Tomohiro IWANO, Takaaki MATSUMOTO, Tomoyasu HASEGAWA, Tomomi KUKITA
Estimating the term…
A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and a ratio of the lowest valence among the plurality of valences of the metal is 0.10 or more in X-ray photoelectron spectroscopy.
A slurry comprising abrasive grains and a liquid medium, wherein
Dependencies are inferred from the claim text.