Uv-curable putty composition for covering, filling, and repairing substrate defects

Abstract

A radiation curable putty composition and a method for repairing a defect in a substrate with such composition are provided. The radiation curable putty composition comprises about 6-50 wt % of a UV curable oligomer, about 4-25 wt % of a non-reactive oligomer, about 5-30 wt % of a UV reactive monomer, an extender, about 3-10 wt % of fumed silica, a polyhydroxycarboxylic acid amide, and about 3-6 wt % of photoinitiators, said photoinitiators comprising a surface-cure photoinitiator and a through-cure photoinitiator, and wherein the putty composition has a solids content of about 99 wt % or greater.

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