Thermal conductive silicone composition and semiconductor apparatus

Abstract

A thermal conductive silicone composition including: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 10 to 100,000 mm2/s and not containing an alkoxysilyl group; (B) an organopolysiloxane containing an alkoxysilyl group; (C) one or more thermal conductive fillers selected from irregular-shaped, round, and polyhedral fillers having a thermal conductivity of 10 W/m·K or more; and (D) hydrophobic spherical silica particles having a D50 in a range of 0.005 to 1 μm and a D90/D10 of 3 or less in a volume-based particle size distribution and having an average circularity of 0.8 to 1, wherein an amount of the component (C) is 40 to 85% by volume of the entire thermal conductive silicone composition.

Dependencies are inferred from the claim text.