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US 2025/0083282 A1Published application
Chemical mechanical polishing process using steam for polishing fluid delivery and an apparatus for implementing the same
AssigneeWestern Digital Technologies, Inc.
InventorsYohei YAMADA, Koji KISHIMOTO, Minoru YAMAGUCHI
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Abstract
A chemical mechanical polishing method includes providing a liquid-gas polishing fluid mixture to a polishing pad, and polishing a surface of a work piece on the polishing pad using the liquid-gas polishing fluid mixture.
Claims20
A chemical mechanical polishing (CMP) method, comprising:
- providing a liquid-gas polishing fluid mixture to a polishing pad;
- and
- polishing a surface of a work piece on the polishing pad using the liquid-gas polishing fluid mixture.
A chemical mechanical polishing (CMP) apparatus, comprising:
- a platen configured to support a polishing pad thereupon;
- a wafer carrier configured to hold a wafer and to press the wafer against a top surface of the polishing pad;
- and
- a polishing fluid dispensation system comprising:
- a polishing fluid tank configured to store a polishing fluid containing at least one liquid phase material;
- a vaporizer configured to convert the polishing fluid into polishing fluid mixture of a gas and a liquid;
- a carrier gas supply system configured to provide a heated carrier gas;
- a mixer configured to mix the polishing fluid mixture and the carrier gas to form a liquid-gas polishing fluid mixture;
- and
- a polishing fluid conduit configured to provide the liquid-gas polishing fluid mixture over the polishing pad.
7 more elements
Dependencies are inferred from the claim text.