Polishing process apparatus

A polishing process apparatus, comprising:

• a carrier including a polishing head configured to receive a polishing object, a drive shaft configured to rotate the polishing head, and a temperature sensor mounting portion connected to the drive shaft;
• a polishing pad on a lower portion of the carrier;
• a plurality of temperature sensors on the temperature sensor mounting portion;
• and
• a controller configured to control the carrier, the polishing pad, and the plurality of temperature sensors,
• wherein the polishing head has a first radius from a central axis of the polishing head,
• the plurality of temperature sensors are configured along an arc having a second radius from the central axis of the polishing head, and the second radius has a value greater than that of the first radius, and
• the controller is configured to determine an end point in time of a polishing process using temperatures measured by the plurality of temperature sensors.

A polishing process apparatus, comprising:

• a carrier including a polishing head configured to receive a polishing object;
• a polishing pad on a lower portion of the carrier;
• a plurality of temperature sensors on the carrier;
• and
• a controller configured to control the carrier, the polishing pad, and the plurality of temperature sensors,
• wherein the polishing object includes a plurality of regions,
• the plurality of temperature sensors are configured to respectively measure temperatures corresponding to the plurality of regions of the polishing object, different from each other, while a polishing process is performed, and
• the controller is configured to receive the temperatures from the plurality of temperature sensors and derive temperature data, to calculate temperature change data using the temperature data, and to determine an end point in time of a polishing process using the temperature change data.