Laser machining method and laser machining device
AssigneeUshio Denki Kabushiki Kaisha
InventorTakehito SENGA
Life of this patent
Estimating the term…
Loading patent…
AssigneeUshio Denki Kabushiki Kaisha
InventorTakehito SENGA
Estimating the term…
A laser machining method and a laser machining device according to the present invention include: emitting a beam of laser light in a form of pulse separated from each other; making a plurality of beams of the laser light incident on a light collection optical system that reduces a gap between the beams of the laser light; irradiating the surface to be machined with the plurality of beams of the laser light emitted to form a plurality of focused spots separated from each other, the plurality of focused spots each causing ablation; and moving the light collection optical system and the surface to be machined relative to each other both to simultaneously form a plurality of grooves on the surface to be machined.
A laser machining method comprising:
A laser machining device comprising:
Dependencies are inferred from the claim text.