Laser machining device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKOJI FUNAMI, KAZUKI FUJIWARA, IZURU NAKAI, TATSURO SHIRAISHI
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKOJI FUNAMI, KAZUKI FUJIWARA, IZURU NAKAI, TATSURO SHIRAISHI
Estimating the term…
A laser machining device according to one aspect of the present disclosure includes: a welding device that irradiates a workpiece with laser irradiation light to perform welding; and a welding light measurement device including an imaging optical system, a first photodetector, and a second photodetector, the welding light measurement device receiving and measuring welding light emitted from the workpiece during laser welding. The welding light includes first light in a first wavelength region and second light in a second wavelength region, and the imaging optical system includes a wavelength selection mask, and forms an image of a light beam of the first light transmitted through the wavelength selection mask on the first photodetector and forms an image of a light beam of the second light transmitted through the wavelength selection mask on the second photodetector. The wavelength selection mask includes a first region and a second region that receive the welding light, the first region reflects the second light and transmits the first light, the second region transmits the first light and the second light, and the second region has a smaller light receiving area than the first region. The first photodetector and the second photodetector are disposed on an optical axis of the welding light incident on the wavelength selection mask.
A laser machining device comprising:
Dependencies are inferred from the claim text.