Reverse soldering connection structure of microneedle and wiring and preparation process therefor

A process for preparing a reverse soldering connection structure of a microneedle and a wiring, comprising following steps:

• S1, preparing a reverse soldering metal layer of the microneedle;
• S2, preparing a reverse soldering metal layer of the wiring;
• and
• S3, aligning the reverse soldering metal layer of the microneedle with the reverse soldering metal layer of the wiring, and pressing the reverse soldering metal layer of the microneedle and the reverse soldering metal layer of the wiring to form a reverse soldering connection structure;
• wherein the preparing the reverse soldering metal layer of the microneedle comprises:
• preparing a microneedle insulation layer on the microneedle;
• etching the microneedle insulation layer at a designated position to form an etching hole, and electroplating metal in the etching hole;
• and
• releasing the microneedle insulation layer to expose the reverse soldering metal layer of the microneedle.