Copper alloy powder for lamination shaping, lamination shaped product production method, and lamination shaped product
AssigneeJX Nippon Mining & Metals Corporation
InventorsKenji SATO, Yoshitaka SHIBUYA
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Abstract
An object of the present invention is to provide a copper alloy powder for lamination shaping comprising a copper alloy, a method for producing a lamination shaped product and a lamination shaped product, which can achieve coexistence of mechanical strength and conductivity. One aspect of the present invention relates to a copper alloy powder for lamination shaping, including at least one additive element having a solid solution amount to copper of less than 0.2 at %.
Claims5
A method for producing a lamination shaped product using a copper alloy powder for lamination shaping comprising at least one additive element having a solid solution amount to copper of less than 0.2 at %, the method comprising the steps of:
- spreading the copper alloy powder on a shaping stage to form a thin layer thereon;
- and
- irradiating a portion of the thin layer to be shaped with an electron beam to melt the copper alloy powder and then solidifying the molten copper alloy powder by natural cooling;
- wherein the steps are repeated several times to produce a lamination shaped product.
A method for producing a lamination shaped product using a copper alloy powder for lamination shaping comprising at least one additive element having a solid solution amount to copper of less than 0.2 at %, the method comprising the steps of:
- spreading the copper alloy powder on a shaping stage to form a thin layer thereon;
- and
- irradiating a portion of the thin layer to be shaped with a laser beam to melt the copper alloy powder and then solidifying the molten copper alloy powder by natural cooling;
- wherein the steps are repeated several times to produce a lamination shaped product.
A lamination shaped product comprising a copper alloy, wherein the copper alloy contains at least one additive element having a solid solution amount of less than 0.2 at %, and the copper alloy has a relative density of 98% or more relative to theoretical density;
- a conductivity of 50% IACS or more, and a 0.2% yield strength of 700 MPa or more.
Dependencies are inferred from the claim text.