Back to results
US 2025/0083181 A1Published application
Conductive molded enclosure
OwnerWilliam Joseph Nepsha, Steven Kurtzweg +2inventors
InventorsWilliam Joseph Nepsha, Steven Kurtzweg, Ryan Gaveske, Jennifer Ollila
Life of this patent
Estimating the term…
Abstract
A method of painting an enclosure can included providing an enclosure formed from a conductive sheet molding compound. A powder coating can be applied to at least one surface of the enclosure, and the powder coating can be cured by heating the enclosure at a curing temperature.
Claims20
A method of painting an enclosure, the method comprising:
- providing an enclosure formed from conductive sheet molding compound, including side walls that extend integrally around an internal cavity for electronics;
- electrostatically applying a powder coating to at least one surface of the enclosure;
- and
- curing the powder coating by heating the enclosure at a curing temperature.
1 more element
An enclosure comprising:
- an enclosure body formed integrally from conductive sheet molding compound, including side walls that extend integrally around an internal cavity for electronics and define an opening into the internal cavity;
- and
- a cover formed from the conductive sheet molding compound and sized to block the opening into the internal cavity.
A method of grounding an enclosure, the method comprising:
- providing an enclosure formed from a conductive sheet molding compound, including side walls that extend integrally around an internal cavity for electronics;
- and
- securing a grounding connection at a conductive outer surface of the enclosure.
Dependencies are inferred from the claim text.