Back to results
US 2025/0079942 A1Published application
Heat management system and vehicle
AssigneeToyota Jidosha Kabushiki Kaisha
InventorHiroshi YAMAMOTO
Life of this patent
Estimating the term…
Abstract
The heat management system includes a power semiconductor (heat generation portion). The power semiconductor has a heat dissipation path. The heat dissipation path is configured to transfer heat from the power semiconductor to other portions than the power semiconductor. As the temperature of the power semiconductor increases, the amount of heat dissipation of the power semiconductor through the heat dissipation path increases.
Claims5
A heat management system comprising a heat generation portion including a plurality of heat dissipation paths, wherein
- the heat dissipation paths include a first heat dissipation path and a second heat dissipation path,
- the first heat dissipation path is configured to transfer heat from the heat generation portion to another portion other than the heat generation portion, and
- a heat dissipation amount of the heat generation portion through the second heat dissipation path increases along with a temperature rise of the heat generation portion.
Dependencies are inferred from the claim text.