Bond head having individually-displaceable bond arms

Abstract

A method of transferring a plurality of electronic devices with a bond head mechanism having a bond head having a plurality of individually-displaceable bond arms includes the steps of: in a pickup operation, moving the bond head mechanism to position a first bond arm of the bond head mechanism over a first electronic device from a group of electronic devices from a supply of electronic devices arranged in a pickup area, and actuating only the first bond arm to pick up the first electronic device from the group of electronic devices; and moving the bond head to position a second bond arm of the bond head over a second electronic device from the group of electronic devices, and actuating only the second bond arm of the bond head to pick up the second electronic device.

Dependencies are inferred from the claim text.