Micro-led display and method for manufacturing same

A micro LED display, comprising:

• a first conductive-type electrode;
• a plurality of micro LEDs that are separately formed on the first conductive-type electrode and each configured to emit ultraviolet light with a wavelength of 405 nm or less;
• second conductive-type electrodes formed on the plurality of micro LEDs, respectively;
• a reflective barrier member erected between the plurality of micro LEDs to reflect light from side surfaces of the micro LEDs;
• a film-like wiring substrate having a wiring structure that is connected with the second conductive-type electrodes of three micro LEDs that are adjacent to each other, out of the plurality of micro LEDs, so as to constitute one pixel;
• and
• a phosphor-dispersed resin that is filled between the micro LEDs and the reflective barrier layer, the resin being configured to perform wavelength conversion of respective light from the three micro LEDs into red, green, and blue colors,
• wherein the side surfaces of the micro LEDs are formed into inclined surfaces such that widths of the micro LEDs gradually decrease from the first conductive-type electrode toward the second conductive-type electrodes, and
• wherein the reflective barrier member is erected parallel to a stacking direction of the plurality of micro LEDs and up to a height equal to the micro LEDs.

A manufacturing method of a micro LED display, comprising:

• a step of epitaxially growing a GaN buffer layer, an n-type layer, a light-emitting layer, and a p-type layer on a sapphire substrate, in order;
• a step of forming a transparent electrode on the p layer by vapor deposition;
• a step of bonding a conductive substrate onto the transparent electrode;
• a step of lifting off the sapphire substrate and the GaN buffer layer;
• a step of forming a plurality of micro LEDs by etching from a side of the n-type layer, while forming inclined surfaces on side surfaces of the micro LEDs;
• a step of forming n-electrodes on the plurality of micro LEDs by vapor deposition, respectively;
• a step of forming a passivation layer on parts of the plurality of micro LEDs other than the n-electrodes;
• a step of erecting a reflective barrier member between the plurality of LEDs;
• a step of forming a film-like wiring substrate on the n-electrodes such that three micro LEDs that are adjacent to each other, out of the plurality of micro LEDs, constitute one pixel;
• and
• a step of forming a film-like wavelength conversion layer on the wiring substrate, the wavelength conversion layer including phosphors that perform wavelength conversion of respective light from the three micro LEDs into red, green, and blue colors,
• wherein the side surfaces of the micro LEDs are formed into inclined surfaces such that widths of the micro LEDs gradually decrease from the conductive substrate toward the n-type layer, and
• wherein the reflective barrier member is erected parallel to a stacking direction of the plurality of micro LEDs and up to a height equal to the micro LEDs.

A manufacturing method of a micro LED display, comprising:

• a step of epitaxially growing a GaN buffer layer, an n-type layer, a light-emitting layer, and a p-type layer on a sapphire substrate, in order;
• a step of forming a transparent electrode on the p layer by vapor deposition;
• a step of bonding a conductive substrate onto the transparent electrode;
• a step of lifting off the sapphire substrate and the GaN buffer layer;
• a step of forming a plurality of micro LEDs by etching from a side of the n-type layer, while forming inclined surfaces on side surfaces of the micro LEDs;
• a step of forming n-electrodes on the plurality of micro LEDs by vapor deposition, respectively;
• a step of forming a passivation layer on parts of the plurality of micro LEDs other than the n-electrodes;
• a step of erecting a reflective barrier member between the plurality of LEDs;
• a step of filling a phosphor-dispersed resin between the micro LEDs and the reflective barrier layer, the resin being configured to perform wavelength conversion of respective light from the three micro LEDs into red, green, and blue colors;
• and
• a step of forming a film-like wiring substrate on the n-electrodes such that the three micro LEDs that are adjacent to each other, out of the plurality of micro LEDs, constitute one pixel,
• wherein the side surfaces of the micro LEDs are formed into inclined surfaces such that widths of the micro LEDs gradually decrease from the conductive substrate toward the n-type layer, and
• wherein the reflective barrier member is erected parallel to a stacking direction of the plurality of micro LEDs and up to a height equal to the micro LEDs.