Immersion-type liquid-cooling device and immersion-type liquid-cooling system

An immersion-type liquid-cooling system comprising:

• at least one immersion-type liquid-cooling device comprising:
• a cooling tank adapted to accommodate a main cooling liquid in a sealed manner so as to immerse, in the main cooling liquid, an electronic device to be cooled:
• a main heat dissipation apparatus attached to the cooling tank and comprising an inner cavity enclosed by a housing and a main circulating component and a heat exchanger accommodated in the inner cavity, wherein the inner cavity is in communication with the cooling tank in a sealed manner, and the main circulating component is adapted to circulate the main cooling liquid between the cooling tank and an exterior of the heat exchanger;
• and
• a cold source interface coupled to the main heat dissipation apparatus and configured to allow an auxiliary cooling liquid to circulate between an external cold source and an interior of the heat exchanger such that the auxiliary cooling liquid exchanges heat with the main cooling liquid at the heat exchanger;
• and
• an auxiliary cooling apparatus coupled to the cold source interface of the at least one immersion-type liquid-cooling device and adapted to circulate the auxiliary cooling liquid between the external cold source and the interior of the heat exchanger.

An immersion-type liquid-cooling system for a large-scale cluster deployment comprising:

• a base comprising a plurality of accommodating portions provided at predetermined positions:
• a plurality of reserved interfaces corresponding to positions of the plurality of accommodating portions:
• an auxiliary cooling apparatus configured between the plurality of reserved interfaces and an external cold source;
• and
• a plurality of immersion-type liquid-cooling devices arranged in the accommodating portions, one of the plurality of immersion-type liquid-cooling devices comprising:
• a cooling tank adapted to accommodate a main cooling liquid in a sealed manner so as to immerse, in the main cooling liquid, an electronic device to be cooled:
• a main heat dissipation apparatus attached to the cooling tank and comprising an inner cavity enclosed by a housing and a main circulating component and a heat exchanger accommodated in the inner cavity, wherein the inner cavity is in communication with the cooling tank in a sealed manner, and the main circulating component is adapted to circulate the main cooling liquid between the cooling tank and an exterior of the heat exchanger;
• and
• a cold source interface coupled to the main heat dissipation apparatus and configured to allow an auxiliary cooling liquid to circulate between an external cold source and an interior of the heat exchanger such that the auxiliary cooling liquid exchanges heat with the main cooling liquid at the heat exchanger,
• wherein cold source interfaces of the immersion-type liquid-cooling devices are coupled to the plurality of reserved interfaces.