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US 2025/0063668 A1Published application
Embedding Methods for Fine-Pitch Components and Corresponding Component Carriers
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsJeesoo Mok, Artan Baftiri
Life of this patent
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Abstract
A component carrier includes: i) a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; ii) a cavity formed in the stack; iii) an electrically conductive contact structure at a bottom of the cavity; and iv) a finishing structure on the electrically conductive contact structure. The finishing structure has a smaller lateral extension than the electrically conductive contact structure.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a cavity formed in the stack;
- an electrically conductive contact structure at a bottom of the cavity;
- and
- a finishing structure on the electrically conductive contact structure;
- wherein the finishing structure has a smaller lateral extension than the electrically conductive contact structure.
3 more elements
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a cavity formed in the stack;
- an electrically conductive contact structure at a bottom of the cavity;
- and
- a finishing structure on the electrically conductive contact structure.
2 more elements
Dependencies are inferred from the claim text.