Systems and methods for supporting a high thermal gradient between a qubit plane and a control system for the qubit plane using a superconducting rigid-flex circuit

A method comprising:

• providing a qubit plane having at least one qubit chip associated with a first rigid circuit portion of a superconducting rigid-flex circuit;
• using a first cooling system maintaining an operating temperature for the qubit plane and the first rigid circuit portion of the superconducting rigid-flex circuit at or below 100 milli-kelvin;
• providing a control system having at least one control chip associated with a second rigid circuit portion of the superconducting rigid-flex circuit;
• using a second cooling system maintaining an operating temperature for the control system and the second rigid circuit portion of the superconducting rigid-flex circuit at or below 10 kelvin, allowing the control chips to dissipate heat to the second cooling system within a thermal budget commensurate with an amount of power required to provide control signals to control qubits within the at least one qubit chip;
• and
• providing a flexible circuit portion of the superconducting rigid-flex circuit for interconnecting the first rigid circuit portion of the superconducting rigid-flex circuit with the second rigid circuit portion of the superconducting rigid-flex circuit.

A system configured to operate in a cryogenic environment, wherein the cryogenic environment having a vacuum with a pressure in a range of 10−3 Torr to 10−10 Torr, the system comprising:

• a qubit plane having qubit chips associated with a first rigid circuit portion of a superconducting rigid-flex circuit;
• a first cooling system operable to maintain an operating temperature for the qubit plane and the first rigid circuit portion of the superconducting rigid-flex circuit at or below 100 milli-kelvin;
• a control system having control chips associated with a second rigid circuit portion of the superconducting rigid-flex circuit;
• a second cooling system operable to maintain an operating temperature for the control system and the second rigid circuit portion of the superconducting rigid-flex circuit at or below 10 kelvin, allowing the control chips to dissipate heat to the second cooling system within a thermal budget commensurate with an amount of power required to provide control signals to control qubits within the qubit chips;
• a flexible circuit portion of the superconducting rigid-flex circuit for interconnecting, and yet thermally isolating, the first rigid circuit portion of the superconducting rigid-flex circuit with the second rigid circuit portion of the superconducting rigid-flex circuit;
• and
• a third cooling system operable to maintain an operating temperature of the flexible circuit portion within a range of 100 milli-kelvin to 10 kelvin.