Electronic device and manufacturing method thereof
AssigneeInnolux Corporation
InventorsTing-Wei LIANG, Jiunn-Shyong LIN, I-An YAO
Life of this patent
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Abstract
A manufacturing method manufactures an electronic device, and includes the steps of: providing a first temporary panel including a first carrier board, a first substrate, a second substrate and a second carrier board arranged in sequence; providing a second temporary panel including a third carrier board, a third substrate, a fourth substrate and a fourth carrier board arranged in sequence; and removing the second carrier board and the third carrier board, and fixing the second substrate and the third substrate with an attaching member.
Claims20
A manufacturing method of an electronic device, comprising the steps of:
- providing a first temporary panel, wherein the first temporary panel includes a first carrier board, a first substrate, a second substrate and a second carrier board arranged in sequence;
- providing a second temporary panel, wherein the second temporary panel includes a third carrier board, a third substrate, a fourth substrate and a fourth carrier board arranged in sequence;
- and
- removing the second carrier board and the third carrier board, and fixing the second substrate and the third substrate with an attaching member.
An electronic device, comprising:
- a supporting component;
- a first panel disposed on the supporting component, wherein the first panel includes a first substrate having a display area and a peripheral circuit area;
- and
- a second panel disposed on the first panel,
- wherein the supporting component overlaps the display area and at least a portion of the peripheral circuit area of the first substrate, and the supporting component has a thickness greater than that of the first substrate.
Dependencies are inferred from the claim text.