Semiconductor package including semiconductor die stacks

A semiconductor package comprising:

• a lower semiconductor die stack in which a plurality of lower semiconductor dies are stacked vertically in a stepwise manner to extend in a first horizontal direction;
• an upper semiconductor die stack in which a plurality of upper semiconductor dies are stacked vertically on the lower semiconductor die stack in a stepwise manner to extend in a first reverse horizontal direction opposite to the first horizontal direction;
• a wiring structure positioned above the upper semiconductor die stack;
• and
• bonding wire groups connecting the lower semiconductor dies and the upper semiconductor dies to the wiring structure, wherein the bonding wire groups comprise a first bonding wire group comprising bonding wires that connect a first plurality of semiconductor dies selected from the lower semiconductor dies and the upper semiconductor dies to the wiring structure, and a second bonding wire group comprising bonding wires that each connect a single one of the upper or lower semiconductor dies to the wiring structure, wherein the first bonding wire group comprises a first bonding portion including a first curved wire connecting a second plurality of semiconductor dies of the first plurality of semiconductor dies, a first upward wire connected to the first curved wire and extending toward the wiring structure, a first inclined wire connected to the first upward wire, and a second upward wire extending toward the wiring structure to connect the first inclined wire to the wiring structure, and
• wherein the bonding wires of the second bonding wire group each comprise a fifth upward wire extending toward the wiring structure to connect the single one of the upper or lower semiconductor dies to the wiring structure.

A semiconductor package comprising:

• a lower semiconductor die stack in which a plurality of lower semiconductor dies are vertically stacked in a stepwise manner to extend in a first horizontal direction;
• an upper semiconductor die stack in which a plurality of upper semiconductor dies are vertically stacked on the lower semiconductor die stack in a stepwise manner to extend in a first reverse horizontal direction opposite to the first horizontal direction;
• a wiring structure positioned above the upper semiconductor die stack;
• a lower bonding wire group connecting the lower semiconductor dies to the wiring structure, wherein the lower bonding wire group comprises a first lower bonding portion including a first lower curved wire connecting at least two of the lower semiconductor dies, a first lower upward wire connected to the first lower curved wire and extending toward the wiring structure, a first lower inclined wire connected to the first lower upward wire, and a second lower upward wire extending toward the wiring structure to connect the first lower inclined wire to the wiring structure;
• and
• an upper bonding wire group electrically connecting the upper semiconductor dies to the wiring structure, wherein the upper bonding wire group comprises a first upper bonding portion including a first upper curved wire connecting at least two of the upper semiconductor dies, and a first upper upward wire extending toward the wiring structure to connect the first upper curved wire to the wiring structure.