Method of manufacturing fan-out packaging device and fan-out packaging device manufactured thereby

A fan-out packaging device, which is a packaging device using a wafer or panel level packaging process, the fan-out packaging device comprising:

• a fan-out packaging substrate;
• an additional GND layer formed on a part of the fan-out packaging substrate;
• a first dielectric layer formed on the additional GND layer, the first dielectric layer comprising a first via hole;
• a redistribution layer (RDL) formed on the first dielectric layer and the first via hole;
• a second dielectric layer formed on the redistribution layer, the second dielectric layer comprising a second via hole formed by patterning, the second via hole being configured to expose a part of the redistribution layer;
• and
• a bump structure formed on the second dielectric layer and the second via hole, the bump structure being connected to the redistribution layer, wherein
• the additional GND layer is formed in directions toward four sides or at least two opposite sides of a die.