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US 2025/0062171 A1Published application
Component Carrier With Surface-Contactable Component Embedded in Laminated Stack
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsHeinz Moitzi, Johannes Stahr, Andreas Zluc
Life of this patent
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Abstract
A component carrier with a laminated stack including at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component embedded in the stack. The component has at least one electrically conductive connection structure exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.
Claims20
A component carrier, comprising:
- a laminated stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure;
- a component having at least one electrically conductive connection structure and embedded in the stack;
- said laminated stack comprising
- a cavity formed in the laminated stack;
- wherein said component being inserted in the cavity defining a gap between the component and the cavity, and
- an adhesive structure, comprising an adhesive material provided in at least a part of the gap between the component and the cavity, so that the component is embedded in the stack;
- wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component is flush with or extends beyond an exterior main surface of the stack.
4 more elements
A system, comprising:
- a component carrier, the component carrier comprising:
- a laminated stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure,
- a component having at least one electrically conductive connection structure,
- said laminated stack comprising:
- a cavity formed in the laminated stack;
- said component being inserted in the cavity defining a gap between the component and the cavity;
- an adhesive structure, comprising an adhesive material provided in at least a part of the gap between the component and the cavity, so that the component is embedded in the stack;
- wherein the at least one electrically conductive connection structure of the component is exposed with respect to the stack so that a free exposed end of the at least one electrically conductive connection structure of the component flushes with or extends beyond an exterior main surface of the stack;
- at least one further component vertically stacked with the component carrier and electrically coupled with the embedded component by the at least one electrically conductive connection structure.
6 more elements
Dependencies are inferred from the claim text.