Substrate structuring method
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsPierre Montmeat, Franck Fournel
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AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsPierre Montmeat, Franck Fournel
Estimating the term…
A method comprising the following steps: a) Bonding a handle substrate including raised elements to a substrate of interest including a support substrate covered with a thin film including a material sensitive to an etchant, whereby the thin film includes first areas not covered with the raised elements and second areas covered with said elements, b) Placing into contact the obtained assembly with a solution including a hydrophobic agent, to cover the first areas with a hydrophobic film, c) Separating the two substrates, d) Placing into contact the substrate of interest with a solution containing the etchant, whereby the material sensitive to the etchant present in the second areas is etched and raised patterns are formed.
Method of forming patterns on a substrate comprising the following steps:
Dependencies are inferred from the claim text.