Mechanism for filtering etching byproduct during semiconductor fabrication and method thereof

A mechanism for filtering an etching byproduct during semiconductor fabrication, comprising:

• an etching tool, having an outlet for discharging the etching byproduct during an operation of the etching tool;
• a pipeline, having a first end connected to the outlet of the etching tool and a second end connected to a pump for sucking the etching byproduct through the pipeline and toward the second end;
• and
• a filter, disposed between the first end and the second end and proximal to the outlet of the etching tool, wherein the filter includes a medium configured to retain the etching byproduct.

A method for filtering an etching byproduct during semiconductor fabrication, comprising:

• etching a portion of a material layer on a substrate by an etching tool;
• discharging the etching byproduct formed from the etched portion of the material layer out of the etching tool to flow through a pipeline;
• solidifying the etching byproduct flowing through the pipeline;
• and
• trapping the solidified byproduct by a filter.