Control method and plasma processing apparatus
AssigneeTokyo Electron Limited
InventorsChishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
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AssigneeTokyo Electron Limited
InventorsChishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
Estimating the term…
A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
1-26. (canceled)
A plasma processing apparatus comprising:
A control method for a plasma processing apparatus, the control method comprising:
A non-transitory computer readable medium that stores a program for causing a computer to execute a process for a plasma processing apparatus, the process comprising:
A power supply system comprising:
Dependencies are inferred from the claim text.