Magnetic component

Abstract

A magnetic component is disclosed and includes a circuit board and a magnetic core set. The circuit board includes two through holes passing through a first surface and a second surface thereof. The magnetic core set includes an upper magnetic cover and a lower magnetic cover disposed on the first surface and the second surface, respectively. The upper magnetic cover includes two magnetic columns connected to the lower magnetic cover through the two through holes. The upper magnetic cover is thermally coupled to a heat dissipation device, and a volume of the upper magnetic cover is greater than that of the lower magnetic cover. A thermal resistance defined from the upper magnetic cover to the heat dissipation device is smaller than that defined from the lower magnetic cover to the heat dissipation device. It helps to make the overall heat distribution of the magnetic component more uniform.

Dependencies are inferred from the claim text.