Superconductor-metal Conductive Material and the Electronic Component and the Method Using the Same

An electronic component, comprising:

• a plurality of composite layers stacked together, wherein each composite layer comprises a ceramic layer and a conductive layer made of a superconductor-metal conductive material is coated on the ceramic layer, wherein the superconductor-metal conductive material, comprising a metal powder, a superconductor powder and an organic carrier adhesive, wherein the metal powder has 50˜95 wt % of a total weight of said metal powder, said superconductor powder and said organic carrier binder, the superconductor powder has 4˜40 wt % of said total weight, and the organic carrier binder has 1-10 wt % of said total weight, wherein the superconductor powder comprises one or more of the following mixtures:
• La2-x-ySrxBayCuO4, La2-x-y BixSryCuO4, La2-x-y-z BixSryCaZCuO4, La2-x-y-z HgxBayCazCuO4, La2-x-ySrxTlyBazCuO6, La2-x-y-z-wSrxTlyBazCawCu2O8, and HgBa2Ca2Cu3O8, where each of x, y, z, and w is between 0.1 and 0.9.

A method for forming an electronic component, comprising:

• coating a superconductor-metal conductive material on a ceramic layer to form a composite layer;
• stacking multiple composite layers together and sintering the stacked multiple composite layers at a temperature above 800° C. to obtain the ceramic electronic component, wherein the superconductor-metal conductive material, comprising a metal powder, a superconductor powder and an organic carrier adhesive, wherein the metal powder has 50˜95 wt % of a total weight of said metal powder, said superconductor powder and said organic carrier binder, the superconductor powder has 4˜40 wt % of said total weight, and the organic carrier binder has 1-10 wt % of said total weight, wherein the superconductor powder comprises one or more of the following mixtures:
• La2-x-ySrxBayCuO4, La2-x-y BixSryCuO4, La2-x-y-z BixSryCaZCuO4, La2-x-y-z HgxBayCazCuO4, La2-x-ySrxTlyBazCuO6, La2-x-y-z-wSrxTlyBazCawCu2O8, and HgBa2Ca2Cu3O8, where each of x, y, z, and w is between 0.1 and 0.9.