Thin film lithium niobate hybrid photonics packaging

A hybrid photonics device package, comprising:

• an electro-optic integrated circuit including a thin film electro-optic layer including lithium and an electrode on a first substrate, the thin film electro-optic layer having a ridge waveguide and a slab portion formed therein, the first substrate including a first oxide layer having a thickness of at least five micrometers on a first underlying substrate;
• and
• a silicon photonics integrated circuit including a second substrate and at least one silicon photonics component on the second substrate, the at least one silicon photonics component including at least one of a III-V laser array and a photodetector array, the second substrate including a second oxide layer having a thickness of less than five micrometers on a silicon substrate, the silicon photonics integrated circuit having a depression therein, the depression being configured to receive at least a portion of the electro-optic integrated circuit;
• wherein the at least one silicon photonics component and the ridge waveguide are optically coupled and wherein one of the electro-optic integrated circuit and the silicon photonics integrated circuit is flip-chip mounted on an other of the electro-optic integrated circuit and the silicon photonics integrated circuit such that the at least the portion of the electro-optic integrated circuit is aligned with the depression and such that the first substrate is farther from the second substrate of the silicon photonics integrated circuit than the ridge waveguide is.