Back to results
US 2025/0059649 A1Published application
Lead-free metallic barrier coatings for copper and zinc-rich surfaces of subterranean hardware and components
AssigneeSchlumberger Technology Corporation
InventorManuel Marya
Life of this patent
Estimating the term…
Abstract
Embodiments presented provide for a Lead-free metallic barrier coating. In some aspects, a metallic barrier coating for Copper and/or Zinc-rich surfaces for downhole equipment and components is provided.
Claims19
A component, comprising:
- at least two consecutive layers wherein a first layer is reactive to at least one of Copper and Zinc, produces an intermetallic when in contact with at least one of solid Copper and Zinc, and a second layer in contact with the first layer wherein the second layer has a compositional range of approximately:
- (Bi+Sb)/(Sn+Zn) in between 0.5 and 3.0 wt. percent,
- Bi:
- 27 to 70 wt. percent,
- Sn:
- 5 to 40 wt. percent,
- Sb, Zn, and other elements as balance,
- and is characterized by a hardness of 18 HVN, or at least 4 times higher than the hardness of Lead in the HVN scale, wherein Bi represents Bismuth, Sb represents Antimony, Sn represents Tin, and Zn represents Zinc.
5 more elements
A method for production of a component, comprising:
- obtaining a body of material, wherein the body of material has one of a Copper and Zinc-rich surface;
- cleaning the body of material;
- covering at least a portion of a surface of the body of material with a first layer;
- and
- covering at least a portion of the first layer with a second layer wherein the second layer has a composition of:
- (Bi+Sb)/(Sn+Zn) in between 0.5 and 3.0,
- Bi:
- 27 to 70 wt. percent,
- Sn:
- 5 to 40 wt. percent,
- Sb, Zn, and other elements as balance,
- and is characterized by a hardness of 18 HVN, or at least 4 times higher than the hardness of Lead in the HVN scale, wherein Bi represents Bismuth, Sb represents Antimony, Sn represents Tin, and Zn represents Zinc.
9 more elements
Dependencies are inferred from the claim text.