Polyamide composition

Abstract

Provided is a polyamide composition, which has high moldability and excellent heat resistance and chemical resistance. The polyamide composition contains a polyamide (A), a copper compound (B1) and a metal halide (B2), and in which the polyamide (A) comprises a diamine unit (X) and a dicarboxylic acid unit (Y), the diamine unit (X) contains 0.1 mol % or more and less than 36 mol % of a diamine unit (X1), and the diamine unit (X1) is a diamine unit derived from an aliphatic diamine, in which the aliphatic diamine has 6 to 10 carbon atoms, the aliphatic diamine having an alkyl group having 2 or 3 carbon atoms bonded to a carbon atom at 2-position when a carbon atom to which any one of two amino groups is bonded is taken as 1-position.

Dependencies are inferred from the claim text.