A probe card structure, comprising:
- at least one first guide plate;
- at least one second guide plate, the at least one second guide plate being parallel to the at least one first guide plate;
- wherein the at least one first guide plate has a plurality of first guide plate through holes, the at least one second guide plate has a plurality of second guide plate through holes, and the plurality of second guide plate through holes respectively correspond to the plurality of first guide plate through holes;
- wherein the plurality of first guide plate through holes have a first quantity of the first guide plate through holes and the plurality of second guide plate through holes have a first quantity of the second guide plate through holes, and the first quantity of the first guide plate through holes corresponds to the first quantity of the second guide plate through holes, the first quantity of the first guide plate through holes defines a first guide plate first area of the at least one first guide plate, and the first quantity of the second guide plate through holes defines a second guide plate first area of the at least one second guide plate, at least one of the first guide plate first area and the second guide plate first area is plated with a guide plate conductive film, and
- a plurality of contact elements including:
- at least one signal probe, the at least one signal probe correspondingly passing through one part of the first quantity of the first guide plate through holes and one part of the first quantity of the second guide plate through holes, wherein each of the at least one signal probe is plated with a probe conductive film, and the probe conductive film is in electrically contact with the guide plate conductive film, wherein the probe conductive film and the signal probe are insulated from each other;
- and
- at least one ground probe, the at least one ground probe correspondingly passing through another part of the first quantity of the first guide plate through holes and another part of the first quantity of the second guide plate through holes, and the at least one ground probe being adjacent to the at least one signal probe;
- wherein at least one of the ground probe is electrically connected to a ground point;
- wherein at least one of the first guide plate through hole or at least one of the second guide plate through hole is plated with the guide plate conductive film, so that the probe conductive film of the signal probe is electrically connected with the ground probe.