Substrate processing apparatus and substrate processing method
AssigneeTes Co., Ltd
InventorsShin-Myoung KIM, Hyun-Suk SONG, Hee-Won KIM
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Abstract
The present disclosure relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method for accurately accommodating a substrate at a central portion of a susceptor even when a tilt angle or a tilt direction of the susceptor on which the substrate is accommodated changes for each substrate or for each substrate process.
Claims10
A substrate processing apparatus comprising:
- a chamber providing a processing space for a substrate;
- a susceptor provided inside the chamber and configured to receive the substrate thereon and heat the substrate;
- a robot arm configured to load the substrate on the susceptor or unload the substrate from the susceptor;
- a tilt adjustment unit configured to adjust a tilt of the susceptor;
- and
- a controller configured to drive the tilt adjustment unit and change a loaded position of the substrate on the susceptor by the robot arm, in accordance with the tilt of the susceptor.
A substrate processing method of a substrate processing apparatus including a susceptor on which a substrate is loaded and a process is performed inside a chamber, the method comprising:
- tilting at least one of a tilt angle or a tilt direction of the susceptor to a predetermined tilt angle and tilt direction;
- extracting a changed position of the robot arm from a tilt-changed position information table in accordance with the tilt angle and the tilt direction of the susceptor;
- and
- changing a position of the robot arm and loading the substrate on an upper surface of the susceptor.
Dependencies are inferred from the claim text.