Thermally conductive board
AssigneeTclad Technology Corporation
InventorsKai-Wei LO, Kuan-Yu CHEN, Hsin-Lung CHEN
Life of this patent
Estimating the term…
Abstract
A thermally conductive board includes a top metal layer, a bottom metal layer, and an electrically insulating but thermally conductive layer (for simplification hereinafter referred to as “thermally conductive layer”) laminated between the top metal layer and the bottom metal layer. The thermally conductive layer satisfies a relation of I˜qa. There is an equivalence relation between I and q; “I” stands for scattering intensity; “q” stands for scattering vector, and “a” stands for the power of q. q ranges from 0.007 Å−1 to 0.1 Å−1, and a ranges from −3 to −4.
Claims12
A thermally conductive board, comprising:
- a top metal layer;
- a bottom metal layer;
- and
- an electrically insulating but thermally conductive layer laminated between the top metal layer and the bottom metal layer, wherein the electrically insulating but thermally conductive layer satisfies a relation during X-ray irradiation:
- I˜qa, wherein:
- an equivalence relation exists between I and q;
- I stands for scattering intensity;
- and
- q stands for scattering vector, wherein q ranges from 0.007 Å−1 to 0.1 Å−1, and a ranges from −3 to −4.
Dependencies are inferred from the claim text.