Sensor package structure and sensing module thereof

A sensing module of a sensor package structure, comprising:

• a sensor chip having a top surface including a sensing region and a carrying region that surrounds the sensing region;
• a ring-shaped supporting layer being disposed on the carrying region of the sensor chip and surrounding the sensing region, wherein the ring-shaped supporting layer includes a plurality of strips in a ring-shaped arrangement, wherein any two of the strips connected to each other jointly define one of corners, and wherein the ring-shaped supporting layer includes:
• an inner surrounding surface facing toward the sensing region;
• and
• an outer surrounding surface arranged away from the sensing region, wherein at least one of the inner surrounding surface and the outer surrounding surface has a plurality of zigzagged microstructures, wherein the zigzagged microstructures include a plurality of round-ended microstructures having a free end that is a round-ended portion having a radius of less than 1 μm, and wherein each of the corners is provided with one of the round-ended microstructures arranged thereon;
• and
• a light-permeable layer disposed on the ring-shaped supporting layer, wherein the light-permeable layer, the inner surrounding surface of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space.

A sensing module of a sensor package structure, comprising:

• a sensor chip having a top surface including a sensing region and a carrying region that surrounds the sensing region;
• a ring-shaped supporting layer being disposed on the carrying region of the sensor chip and surrounding the sensing region, wherein the ring-shaped supporting layer includes:
• an inner surrounding surface facing toward the sensing region;
• and
• an outer surrounding surface arranged away from the sensing region, wherein at least one of the inner surrounding surface and the outer surrounding surface has a plurality of round-ended microstructures sequentially connected to surround the sensing region, wherein a free end of the round-ended microstructures is a round-ended portion having a radius of less than 1 μm;
• and
• a light-permeable layer disposed on the ring-shaped supporting layer, wherein the light-permeable layer, the inner surrounding surface of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space.