Composite film and manufacturing method thereof

Abstract

The present embodiment provides a composite film in which a plurality of composite inorganic particles, which are inorganic particles having a fluoropolymer coating film formed therein, are sintered to form a plane shape. Therefore, the low dielectric inorganic particle composite film may reduce signal loss by being hybridized with an interlayer insulator in a high-frequency 5G area. The low dielectric inorganic particles may minimize transmission loss by enhancing dielectric properties when applied to a 5G smartphone substrate and an IF cable, since the composite film used as an interlayer insulator for a communication substrate material comprises only the inorganic particles. In addition, application of the low dielectric inorganic particles may be expanded to vehicles, construction, and IoT products which will use 5G communication in the future.

Dependencies are inferred from the claim text.