Systems and methods for thermal management of externally mounted electronic equipment for an aircraft

A method for manufacturing a thermal management system, said method comprising:

• forming a cooling structure that defines at least one inlet, at least one outlet, and a duct coupled in flow communication between the at least one inlet and the at least one outlet, wherein the cooling structure is configured to generate a fluid flow from the at least one inlet to the at least one outlet through the duct in response to moving through a fluid;
• positioning an electronics assembly in contact with the cooling structure, wherein the cooling structure is configured to transfer heat generated by the electronics assembly to the fluid moving through the duct to cool the electronics assembly;
• and
• coupling an upper housing to the cooling structure to define an electronics enclosure, wherein the electronics assembly is disposed in the electronics enclosure, wherein the upper housing and cooling structure form a housing extending between a leading end and a trailing end, and wherein the cooling structure is configured to cause the fluid to move through the duct.