Microchannel assembly cooled power circuits for power boxes of substrate processing systems

A cooling system for a power circuit of a substrate processing tool, the cooling system comprising:

• a microchannel assembly comprising
• an input manifold,
• an output manifold, and
• a microchannel member comprising a plurality of microchannels extending from the input manifold to the output manifold and configured to pass a coolant from the input manifold to the output manifold;
• and
• a plurality of printed circuit board layers comprising a first printed circuit board layer and a second printed circuit board layer, wherein the first printed circuit board layer is disposed on a first side of the microchannel member, wherein the second printed circuit board layer is disposed on a second side of the microchannel member, and wherein the plurality of printed circuit board layers comprise the power circuit including a plurality of electrical components configured to power one or more electrical components of the substrate processing tool,
• wherein
• the microchannel assembly includes only a single microchannel layer cooling a first printed circuit board and a second printed circuit board,
• the first printed circuit board comprising the first printed circuit board layer, and
• the second printed circuit board comprising the first printed circuit board layer.

A cooling system for a power circuit of a substrate processing tool, the cooling system comprising:

• a microchannel assembly comprising
• an input manifold,
• an output manifold, and
• a microchannel member comprising a plurality of microchannels extending from the input manifold to the output manifold and configured to pass a coolant from the input manifold to the output manifold;
• and
• a plurality of printed circuit board layers comprising a first printed circuit board layer and a second printed circuit board layer, wherein the first printed circuit board layer is disposed on and contacts a first side of the microchannel member, wherein the second printed circuit board layer is disposed on and contacts a second side of the microchannel member, and wherein the plurality of printed circuit board layers comprise the power circuit including a plurality of electrical components configured to power one or more electrical components of the substrate processing tool.