Cooling module, electronic system and control method thereof

Abstract

An electronic system includes a heat source and a cooling module. The cooling module includes a cold plate and a thermally conductive component. The cold plate has a fluid chamber, a thermally coupling surface and a heat dissipation surface, the fluid chamber is located between the thermally coupling surface and the heat dissipation surface, and the thermally coupling surface is thermally coupled with the heat source. The thermally conductive component is thermally coupled with the cold plate. The thermally conductive component extends from one side of the cold plate located closer to the thermally coupling surface to another side of the cold plate located closer to the heat dissipation surface.

Dependencies are inferred from the claim text.