Circuit board

A circuit board comprising:

• a first insulating layer;
• a second insulating layer disposed on the first circuit pattern layer and having a first cavity;
• and
• a first circuit pattern layer disposed between the first insulating layer and the second insulating layer,
• wherein the first circuit pattern layer includes:
• a first pad part overlapping the first cavity along a vertical direction;
• a second pad part that does not overlap the first cavity along the vertical direction;
• and
• a connection pattern part disposed between the first pad part and the second pad part,
• wherein the connection pattern part includes a first portion disposed inside the first cavity and connected to the first pad part, and a second portion disposed outside the first cavity and connected to the second pad part, and
• wherein the connection pattern part includes a plurality of connection patterns extending along a direction from the inside of the first cavity to the outside of the first cavity and spaced apart from each other along a horizontal direction.