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US 2025/0030219 A1Published application
Laser component and method for producing a laser component
Assigneeams-OSRAM International GmbH
InventorsTobias HAUPELTSHOFER, Markus Reinhard HORN, Christoph WALTER
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Abstract
The invention relates to a laser component including a first laser chip with a first emission region, a second laser chip with a second emission region, and a connection carrier with an upper side and an underside, wherein the first laser chip is secured to the upper side of the connection carrier and is electrically connected, the second laser chip is secured to the underside of the connection carrier and is electrically connected, and the connection carrier has a thickness of max. 200 μm.
Claims14
A laser component comprising:
- a first laser chip having a first emission region,
- a second laser chip having a second emission region, and
- a connection carrier having an upper side and a lower side, wherein
- the first laser chip is attached and electrically connected to the upper side of the connection carrier,
- the second laser chip is attached and electrically connected to the lower side of the connection carrier, and
- the connection carrier has a thickness of at most 200 μm.
3 more elements
A method for producing a laser component, comprising:
- providing a module carrier plate,
- applying second laser chips and third laser chips on the module carrier plate,
- applying a connection carrier plate on the second laser chips and third laser chips on their side facing away from the module carrier plate,
- thinning the connection carrier plate,
- applying first laser chips laterally between each second laser chip and each third laser chip on the side of the connection carrier plate facing away from the second laser chips and third laser chips, and
- dividing into individual laser components each comprising a first laser chip, a second laser chip, a third laser chip, and a part of the connection carrier plate as a connection carrier.
3 more elements
Dependencies are inferred from the claim text.