Structure and method for integrating through metal contacts and fluid channels

A device for cooling a circuit, comprising:

• a first semiconductor substrate having a first metal component extending from a first surface of the first semiconductor substrate toward an interior of the first semiconductor substrate and a channel etched into and along the first surface of the first semiconductor substrate;
• a second semiconductor substrate having a second metal component extending from a first surface of the second semiconductor substrate towards an interior of the second semiconductor substrate;
• an interface along which the first surface of the first semiconductor substrate is bonded with the first surface of the second semiconductor substrate to seal a fluid inside the channel between the first semiconductor substrate and the second semiconductor substrate and form a metal via from the first metal component coupled with the second metal component;
• and
• a device die in thermal contact with the first semiconductor substrate via a second interface along which the device die is bonded with the a second surface of the first semiconductor substrate to dissipate heat generated by a circuit in the device die to the fluid in the channel and electrically connect the metal via to the circuit.