Electronic circuit apparatus and circuit-integrated motor
AssigneeMikuni Corporation
InventorsYuki KONNO, Yuji YOKOTA, Satoru FUJISAKI
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Abstract
An electronic circuit apparatus 1 includes: at least one semiconductor device 10; a substrate 20 installed with the semiconductor device 10 and having a through hole 24 at a position facing a back surface 17 of the semiconductor device 10; a heat sink 30 located on an opposite side of the substrate 20 from the semiconductor device 10 and having at least one protruding portion 32 protruding toward the back surface 17 of the semiconductor device 10 so as to penetrate into the through hole 24 of the substrate 20; and a heat-dissipating material 40 disposed at least between the back surface 17 of the semiconductor device 10 and a top surface 33 of the protruding portion 32 of the heat sink 30.
Claims13
An electronic circuit apparatus, comprising:
- at least one semiconductor device;
- a substrate installed with the semiconductor device and having a through hole at a position facing a back surface of the semiconductor device;
- a heat sink located on an opposite side of the substrate from the semiconductor device and having at least one protruding portion protruding toward the back surface of the semiconductor device so as to penetrate into the through hole of the substrate;
- and
- a heat-dissipating material disposed at least between the back surface of the semiconductor device and a top surface of the protruding portion of the heat sink.
Dependencies are inferred from the claim text.