Chuck table and semiconductor package manufacturing method using the same

A chuck table comprising:

• a support part receiving a package substrate, the package substrate including a package area having a plurality of semiconductor packages arranged thereon and a scrap area surrounding the package area;
• a package pad part disposed between the support part and the package substrate, the package pad part directly contacting the package area;
• a scrap pad part disposed between the support part and the package substrate, the scrap pad part directly contacting the scrap area;
• a vacuum pipe extending through the package pad part and extending into the support part, the vacuum pipe has vacuum pressure applied thereto and has the vacuum pressure released therefrom;
• and
• a fixing device connected to the vacuum pipe and driven by the vacuum pressure applied to the vacuum pipe,
• wherein the fixing device includes:
• a compression member compressed by the vacuum pressure applied to the vacuum pipe and having a restoring force,
• a moving member connected to the compression member, the moving member is movable in the vacuum pipe by the application or release of the vacuum pressure, and
• a fixing member connected to the moving member and having a distance from the scrap area adjusted according to a moving direction of the moving member.

A semiconductor package manufacturing method, comprising:

• preparing a package substrate including a package area having a plurality of semiconductor packages arranged thereon and a scrap area surrounding the package area;
• positioning the package substrate on a chuck table including a vacuum pipe that adsorbs the package area and a fixing device that is connected to the vacuum pipe and positions and fixes the scrap area;
• applying vacuum pressure to the vacuum pipe;
• sawing the package substrate to singulate the plurality of semiconductor packages;
• and
• releasing the vacuum pressure to the vacuum pipe,
• wherein in the applying of the vacuum pressure to the vacuum pipe, the fixing device approaches an upper surface of the scrap area, and
• in the releasing of the vacuum pressure to the vacuum pipe, the fixing device moves away from the upper surface of the scrap region.