Substrate processing apparatus and substrate processing method using the same

A substrate processing apparatus comprising:

• a process chamber including a process space;
• a stage in the process space and configured to support a substrate;
• a rotator below the stage and configured to rotate the stage;
• a pressurizing pump configured to increase a pressure in the process space;
• and
• a cleaning agent discharger configured to spray a cleaning agent into the process space,
• wherein the cleaning agent discharger includes:
• a discharge ring including a discharge passage;
• and
• a discharge nozzle connected to the discharge ring, and
• wherein the discharge nozzle includes:
• a discharge body including a spray space connected to the discharge passage and a central hole through which the cleaning agent is sprayed into the process space;
• a piezoelectric element;
• and
• an elastic portion including an elastic hole that is opened and closed by the piezoelectric element, the elastic portion being configured to discharge the cleaning agent from the discharge passage into the process space to control a spraying cycle and a spraying amount of the cleaning agent.

A substrate processing method, the method comprising:

• introducing a substrate into a substrate processing apparatus;
• injecting pressurized gas into the substrate processing apparatus to increase a pressure inside the substrate processing apparatus to a first pressure or higher;
• and
• drying the substrate after the pressure inside the substrate processing apparatus becomes higher than the first pressure,
• wherein the substrate processing apparatus includes:
• a process chamber including a process space;
• a stage configured to support a substrate;
• a heater configured to increase a temperature of the process space;
• a rotator configured to rotate the stage;
• a pressurizing pump configured to increase a pressure in the process space;
• and
• a cleaning agent discharger configured to spray a cleaning agent into the process space,
• wherein the cleaning agent discharger is on the stage and includes a plurality of discharge nozzles spaced apart in a circumferential direction around a central axis of the stage, and
• wherein the drying of the substrate includes:
• increasing a temperature of the process space to a first temperature or higher using the heater;
• and
• spraying a cleaning agent from the discharge nozzle after raising the temperature of the process space to the first temperature or higher.