Methods and compositions for trench formation using advanced track-based patterning processes
AssigneeTokyo Electron Limited
InventorsDavid Conklin, Charlotte Cutler, Michael Murphy, Jodi Grzeskowiak
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsDavid Conklin, Charlotte Cutler, Michael Murphy, Jodi Grzeskowiak
Estimating the term…
A method for forming a semiconductor device can include coating a reversible overcoat layer over first mandrels on a substrate, inducing a crosslinking reaction within the reversible overcoat layer that renders the reversible overcoat layer insoluble to a developer and forms a crosslinked overcoat layer, diffusing acid particles from the first mandrels into first portions of the crosslinked overcoat layer, inducing a de-crosslinking reaction within the first portions of the crosslinked overcoat layer to form de-crosslinked regions, where unmodified regions of the crosslinked overcoat layer form second mandrels, and selectively removing the de-crosslinked regions with the developer such that the first mandrels and the second mandrels form a mandrel pattern over the substrate, where the developer has a solubility distance in a range of zero to seven in a Hansen Solubility Parameter space relative to methyl isobutyl carbinol.
A developer comprising a developer composition configured to selectively remove a solubility switched region of a layer of a first material during a semiconductor manufacturing process for forming a mandrel pattern in the layer on a substrate, wherein the developer composition has a solubility distance in a range of zero to seven in a Hansen Solubility Parameter (HSP) space relative to methyl isobutyl carbinol (MIBC).
A method for forming a semiconductor device, the method comprising:
A method of formulating a developer for developing a patterning material having a reversible solubility in a process of manufacturing a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.