Systems for and methods for clock calibration adjustment for three-dimensional intergrated circuits (3dic)

A system, comprising:

• a first semiconductor die comprising:
• a first conductive element configured to receive a first signal;
• a second conductive element configured to convey the first signal to a second semiconductor die;
• a third conductive element configured to receive a second signal from the second semiconductor die, the second signal varying from the first signal according to a phase-shift;
• a first circuit configured to determine the phase-shift between the first signal and the second signal;
• and
• a second circuit configured to generate a third signal based on the phase-shift, the first signal, the second signal, and the third signal having a same frequency;
• and
• the second semiconductor die.

A method comprising:

• receiving, at a first conductive element of a first semiconductor die, a first signal;
• conveying, by a second conductive element of the first semiconductor die, the first signal to a second semiconductor die;
• receiving, at a third conductive element of the first semiconductor die, a second signal;
• determining a first phase-shift between the first signal and the second signal;
• generating, responsive to the first phase-shift, a third signal according to a second phase-shift from the first signal;
• and
• providing the third signal to combinatorial logic of the first semiconductor die.