Optical and Electrical Packaging of Photonic Dies
AssigneeTeramount Ltd.
InventorsHesham Taha, Abraham Israel
Life of this patent
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Abstract
Systems, apparatuses, and methods for optical and electrical packaging of semiconductor dies are disclosed. The semiconductor packages may include a first semiconductor die and a second semiconductor die. A spacer may be disposed between the first and second semiconductor dies. The spacer may enable electrical and optical connection of the first and second semiconductor dies. The package may further include an optical fiber connected to one or more of the first or second semiconductor dies. The optical and electrical schemes used herein may enable compact, and convenient packaging of electronically and optically connected components.
Claims20
A system comprising:
- a semiconductor package comprising optical and electrical connections, the semiconductor package comprising:
- a first die and a second die, the first die and the second die being in optical and electrical communication;
- a spacer disposed between the first die and the second die, the spacer configured to facilitate electrical connection and configured to facilitate an optical connection between the first die and the second die.
A method comprising:
- configuring an optically and electrically connected semiconductor package by:
- disposing, at a first side of a spacer, a first semiconductor die;
- disposing, at a second side of the spacer, substantially opposed to the first side of the spacer, a second semiconductor die;
- configuring the spacer to facilitate optical and electrical connection between the first dies and the second dies;
- and
- optically connecting, via a photonic substrate, an optical fiber to the second semiconductor die.
An apparatus comprising:
- a first semiconductor die;
- a second semiconductor die;
- a spacer disposed between the first and second semiconductor dies, wherein the spacer is configured to optically and electrically couple the first and second semiconductor dies;
- and
- a photonic substrate configured to detachably connect an optical fiber to the first semiconductor die and the second semiconductor die.
Dependencies are inferred from the claim text.