Integrated lens in laser micro package through wafer fabrication

An optical device, comprising:

• a substrate comprising a metalens disposed on a first surface of the substrate;
• a laser source disposed on the first surface;
• and
• a lid hermetically sealing the laser source and the metalens, wherein the lid comprises a turning mirror arranged to receive an optical signal from the laser source and reflect the optical signal to the metalens, wherein the optical signal passes through the metalens and the substrate.

An optical device, comprising:

• a substrate comprising a focusing element disposed on a first surface of the substrate;
• a laser source disposed on the first surface;
• a lid hermetically sealing the laser source and the focusing element, wherein the lid comprises a turning mirror arranged to receive an optical signal from the laser source and reflect the optical signal to the focusing element, wherein the optical signal passes through the focusing element and the substrate;
• and
• a quarter-wave plate on a second surface of the substrate, wherein the second surface is opposite the first surface, wherein the optical signal is configured to pass through the quarter-wave plate after passing through the substrate.