Jet stream type plating device

Abstract

Provided is a nozzle structure in a jet plating tank through which the nozzle structure can be installed in the reduced space with simple composition, the plating liquid can be almost uniformly jetted on the semiconductor wafer surface and decentralization and homogenization of the plating liquid in the plating tank can be conducted, thereby thickness growth can be promoted. In the nozzle structure, a plurality of jet paths in an opening portion of the nozzle for jetting the liquid formed plating are and decentralization and homogenization of the plating liquid in the plating tank are conducted by the plating liquid jetted from a terminal end opening portion of each jet path.

Dependencies are inferred from the claim text.