Methods of adjusting uniformity, and related apparatus and systems, for semiconductor manufacturing
AssigneeApplied Materials, Inc.
InventorsTetsuya ISHIKAWA, Kim Ramkumar VELLORE
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AssigneeApplied Materials, Inc.
InventorsTetsuya ISHIKAWA, Kim Ramkumar VELLORE
Estimating the term…
The present disclosure relates to methods of adjusting uniformity for substrate processing, and related apparatus and systems, for semiconductor manufacturing. In one or more embodiments, a heating power applied to a set of one or more heat sources is adjusted by an adjustment factor. In one or more embodiments, a method of adjusting uniformity. The method includes scanning a sensor across one or more sections to take a plurality of readings, generating a signal profile including the plurality of readings, and analyzing the signal profile by comparing the signal profile to a range. The method includes adjusting one or more heating parameters if at least one portion of the signal profile is outside of the range. The adjusting includes identifying a set of one or more heat sources that correlate with the at least one portion of the signal profile, and adjusting a heating power by an adjustment factor.
A method of adjusting uniformity for substrate processing applicable for semiconductor manufacturing, the method comprising:
A non-transitory computer readable medium applicable for semiconductor manufacturing, the non-transitory computer readable medium comprising instructions that when executed cause a plurality of operations to be conducted, the plurality of operations comprising:
A system for processing substrates and applicable for semiconductor manufacturing, the system comprising:
Dependencies are inferred from the claim text.